- SIDE BRAZE PACKAGE fits the large, middle and small scales semiconductor IC of TTL,MOS,ECL,ect. The pitch is 2.54mm,the number of pins can reach64.Read More
- PGA is widely used for MOS.ECL circuit packaging. The number of pins may attain 208.Read More
- CFP and CQFP both are a kind of high sealed package with better mechanical function and better chemical stability for semiconductor IC. The pitch of CFP is 1.27mm.The number of pins of CQFP may attain 132 with 0.635mm lead pitch.Read More
All microelectronic ceramic package products come in top quality and reliable price. As one of leading manufacturers and suppliers in China, we warmly welcome you to buy custom microelectronic ceramic package from our factory.