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Dip Dual In-Line Package

Dip Dual In-Line Package
SIDE BRAZE PACKAGE fits the large, middle and small scales semiconductor IC of TTL,MOS,ECL,ect. The pitch is 2.54mm,the number of pins can reach64.
Product Details

SIDE BRAZE PACKAGE fits the large, middle and small scales semiconductor IC of TTL,MOS,ECL,ect. The pitch is 2.54mm,the number of pins can reach64.


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